HEATSINK BGA W/O SOLDER ANCHORS - 374224B60023G - Thermal Management

Digi-Key Part Number HS329-ND
Price Break
1080
Unit Price
3.33638
Extended Price
3603.29
Manufacturer Part Number374224B60023G
DescriptionHEATSINK BGA W/O SOLDER ANCHORS
Quantity Available Non-Stock
All prices are in EUR

Order: HEATSINK BGA W/O SOLDER ANCHORS - 374224B60023G - Thermal Management
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HEATSINK BGA W/O SOLDER ANCHORS - 374224B60023G - Thermal Management
Technical/Catalog Information374224B60023G
VendorAavid Thermalloy
CategoryThermal Management
Attachment MethodThermal Tape
Height0.984" (24.99mm)
Material-
Package CooledBGA - Metal
Power Dissipation @ Temperature Rise1W @ 20°C
Series-
Thermal Resistance @ Forced Air Flow5 °C/W @ 350 LFM
Outline L x W23mm x 23mm
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names 374224B60023G
374224B60023G
HS329 ND
HS329ND
HS329
Image of HEATSINK BGA W/O SOLDER ANCHORS - 374224B60023G
HEATSINK BGA W/O SOLDER ANCHORS - 374224B60023G
(HS329-ND) - Thermal Management

HEATSINK BGA W/O SOLDER ANCHORS - 374224B60023G

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HEATSINK BGA W/O SOLDER ANCHORS - 374224B60023G (HS329-ND) - Thermal Management

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